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Patent Searching and Data


Title:
COMPOSITION FOR FORMING RELEASING LAYERS, AND RELEASING LAYER
Document Type and Number:
WIPO Patent Application WO/2018/181496
Kind Code:
A1
Abstract:
Provided is a composition for forming releasing layers, which contains: a polyamic acid that contains a structural unit represented by formula (1) and has a weight average molecular weight of 5,000 or more; and an organic solvent. [(In the formula, X1 represents a phenyl group or a biphenyl group; Z1 represents a group represented by formula [Z1]; and n1 represents a natural number.) (In formula [Z1], Y1 represents a single bond or a linking group; Y2 represents a single bond, an alkylene group having 1-15 carbon atoms, or the like; Y3 represents a single bond, an alkylene group having 1-15 carbon atoms, or the like; Y4 represents a single bond, a cyclic group, a divalent organic group having a steroid skeleton, or the like; Y5 represents a divalent cyclic group such as a benzene ring, or the like; n represents an integer of 0-4, and in cases where n is 2 or more, the Y5 moieties may be the same as or different from each other; Y6 represents a hydrogen atom, an alkyl group having 1-18 carbon atoms, or the like; and the linking group represents -O- or the like.)]

Inventors:
YE CHENJIA (TW)
EBARA KAZUYA (JP)
Application Number:
PCT/JP2018/012809
Publication Date:
October 04, 2018
Filing Date:
March 28, 2018
Export Citation:
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Assignee:
NISSAN CHEMICAL CORP (JP)
International Classes:
C08L79/08; B32B7/06; B32B27/00; C08G73/10; C09D177/00; G06F3/041
Domestic Patent References:
WO2016158988A12016-10-06
WO2016129546A12016-08-18
Foreign References:
JPH03121132A1991-05-23
Attorney, Agent or Firm:
PATENT PROFESSIONAL CORPORATION EI-MEI PATENT OFFICE (JP)
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