COMPOSITION FOR FORMING RESIST UNDERLAYER FILM

WIPO Patent Application WO/2022/030469

A1

Provided is a novel composition for forming a resist underlayer film, which is reduced in the amount of sublimated substances that contaminate a device, is improved in the in-plane uniform coatability of a film to be coated thereon, exhibits satisfactory resistance to a chemical solution used in a resist under layer film, and can exhibit other satisfactory properties. This composition for forming a resist underlayer film comprises: a solvent; and a polymer containing a unit structure (A) represented by formula (1) (wherein Ar1 and Ar2 independently represent a benzene ring or a naphthalene ring; R1 and R2 independently represent a group substituted by a hydrogen atom on the ring of each of Ar1 and Ar2; R4 is selected from the group consisting of a hydrogen atom, a trifluoromethyl group, an aryl group having 6 to 40 carbon atoms, and a heterocyclic group; R5 is selected from the group consisting of a hydrogen atom, a trifluoromethyl group, an aryl group having 6 to 40 carbon atoms, and a heterocyclic group; and n1 and n2 independently represent an integer of 0 to 3).

JPH08283210	FRACTIONATION AND PURIFICATION OF AROMATIC POLYAMINE MIXTURE AND ITS USE
JP2004115777	ANTIBACTERIAL POLYMER AND ITS PRODUCTION METHOD, ANTIBACTERIAL POLYMER COATING FILM AND ITS MAKING METHOD, AND ARTICLE HAVING THE COATING FILM ON ITS SURFACE

TOKUNAGA HIKARU (JP)
NAKAJIMA MAKOTO (JP)
NISHIMAKI HIROKAZU (JP)

PCT/JP2021/028714

February 10, 2022

August 03, 2021

Click for automatic bibliography generation  

NISSAN CHEMICAL CORP (JP)

C08G12/08; G03F7/11; G03F7/20; G03F7/26

WO2010147155A1	2010-12-23
WO2018043410A1	2018-03-08

TSUKUNI & ASSOCIATES et al. (JP)

View/Download PDF      PDF Help

Previous Patent: COMPOSITION FOR FORMING RESIST UNDERLAYER FILM

Next Patent: ROOM TEMPERATURE CURABLE RESIN COMPOSITION, COATING AGENT, ADHESIVE AGENT, SEALING AGENT, AND ARTICL...