Title:
COMPOSITION FOR GRINDING, AND METHOD FOR GRINDING SILICON SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2016/143323
Kind Code:
A1
Abstract:
Provided are a composition for grinding, which can achieve both excellent surface quality and high grinding speed, and a method for grinding a silicon substrate. The composition for grinding contains abrasive grains, a basic compound, and at least one of a multiple bond-containing compound or an anionic group-containing compound. The basic compound contains at least one of an alkali metal hydroxide, an alkali metal bicarbonate, an alkali metal carbonate, a cyclic compound, an ionic compound, and a cyclic diamine compound.
Inventors:
MURASE TAKEHIKO (JP)
NISHIMURA AYA (JP)
TAKAHASHI SHUHEI (JP)
TABATA MAKOTO (JP)
MORI YOSHIO (JP)
NISHIMURA AYA (JP)
TAKAHASHI SHUHEI (JP)
TABATA MAKOTO (JP)
MORI YOSHIO (JP)
Application Number:
PCT/JP2016/001226
Publication Date:
September 15, 2016
Filing Date:
March 07, 2016
Export Citation:
Assignee:
FUJIMI INC (JP)
International Classes:
C09K3/14; B24B37/00; C09G1/02; H01L21/304
Domestic Patent References:
| WO2012165016A1 | 2012-12-06 |
Foreign References:
| JP2013505584A | 2013-02-14 | |||
| JP2012182299A | 2012-09-20 | |||
| JP2008112970A | 2008-05-15 | |||
| JP2007180451A | 2007-07-12 | |||
| JP2012012569A | 2012-01-19 |
Attorney, Agent or Firm:
MORI, Tetsuya et al. (JP)
Woods Tetsuya (JP)
Woods Tetsuya (JP)
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