Title:
COMPOSITION AND PHOTOSENSITIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/203845
Kind Code:
A1
Abstract:
Provided is: a composition which comprises a photopolymerizable compound (A) and metal oxide particles (B), and which shows good curability when an initiator (C) is added; a photosensitive composition showing good curability and comprising a photopolymerizable compound (A), metal oxide particles (B), and an initiator (C); and a cured product of said photosensitive composition. The composition comprising a photopolymerizable compound (A) and metal oxide particles (B), or the photosensitive composition comprising a photopolymerizable compound (A), metal oxide particles (B), and an initiator (C) includes, as the photopolymerizable compound (A), a compound with a specific structure having a radical-polymerizable group-containing group.
Inventors:
URAKAWA KAZUKI (JP)
SHIOTA DAI (JP)
SHIOTA DAI (JP)
Application Number:
PCT/JP2023/004534
Publication Date:
October 26, 2023
Filing Date:
February 10, 2023
Export Citation:
Assignee:
TOKYO OHKA KOGYO CO LTD (JP)
International Classes:
C08F20/10; C08F2/44; C08F292/00
Domestic Patent References:
| WO2014119424A1 | 2014-08-07 |
Foreign References:
| JP2010519369A | 2010-06-03 | |||
| JPH1067736A | 1998-03-10 | |||
| JP2008151886A | 2008-07-03 | |||
| JP2008249972A | 2008-10-16 | |||
| JP2006307049A | 2006-11-09 | |||
| JP2015178547A | 2015-10-08 |
Attorney, Agent or Firm:
SHOBAYASHI Masayuki et al. (JP)
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