Title:
COMPOSITION FOR POLISHING SILICON WAFERS
Document Type and Number:
WIPO Patent Application WO/2015/159506
Kind Code:
A1
Abstract:
This invention provides a composition for polishing silicon wafers. Said composition, which excels at reducing haze on the surface of silicon wafers, contains abrasive grains, a silicon-wafer polishing accelerator, an amide-group-containing polymer, and water. The backbone of the amide-group-containing polymer has a structural unit (A) derived from a monomer that can be represented by general formula (1), and the average secondary-particle size of the abrasive grains is between 10 and 60 nm, inclusive.
(1)
Inventors:
TSUCHIYA KOHSUKE (JP)
TANSHO HISANORI (JP)
MORI YOSHIO (JP)
TANSHO HISANORI (JP)
MORI YOSHIO (JP)
Application Number:
PCT/JP2015/001962
Publication Date:
October 22, 2015
Filing Date:
April 07, 2015
Export Citation:
Assignee:
FUJIMI INC (JP)
International Classes:
H01L21/304; B24B37/00; C09G1/02; C09K3/14
Domestic Patent References:
| WO2007055278A1 | 2007-05-18 |
Foreign References:
| JP2008091524A | 2008-04-17 |
Other References:
See also references of EP 3133638A4
Attorney, Agent or Firm:
MORI, Tetsuya et al. (JP)
Woods Tetsuya (JP)
Woods Tetsuya (JP)
Download PDF: