Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
COMPOSITION, PROCESS FOR PRODUCING SHEET, SHEET, LAYERED PRODUCT, AND LAMINATE WITH DEVICE WAFER
Document Type and Number:
WIPO Patent Application WO/2016/052315
Kind Code:
A1
Abstract:
Provided is a composition which has satisfactory elastomer solubility, can have a heightened solid concentration, and can form a film excellent in terms of dryability, surface property, and heat resistance. Also provided are a process for producing a sheet, the sheet, a layered product, and a laminate with a device wafer affixed thereto. The composition comprises: an elastomer which, when heated from 25°C at a heating rate of 20°C/min, has a 5 mass% loss temperature of 375°C or higher; a solvent represented by the following general formula (1) and having a boiling point of 160°C or higher; and a solvent having a boiling point lower than 120°C. In general formula (1), R1 to R6 each independently represent a hydrogen atom or an aliphatic hydrocarbon group.

Inventors:
KAMOCHI YOSHITAKA (JP)
KOYAMA ICHIRO (JP)
IWAI YU (JP)
NAKAMURA ATSUSHI (JP)
SAWANO MITSURU (JP)
Application Number:
PCT/JP2015/077032
Publication Date:
April 07, 2016
Filing Date:
September 25, 2015
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
FUJIFILM CORP (JP)
International Classes:
C08L21/00; B32B25/08; B32B27/00; C08J5/18; C08K5/00; C08L53/02; C09J7/10; C09J11/06; C09J121/00; C09J125/08; C09J153/02; H01L21/02
Domestic Patent References:
WO2013065417A12013-05-10
Foreign References:
JPS51121059A1976-10-22
JP2014037458A2014-02-27
TW201331316A2013-08-01
JP2013072829A2013-04-22
JP2012069416A2012-04-05
JP2004043704A2004-02-12
JP2015191940A2015-11-02
Attorney, Agent or Firm:
SIKs & Co. (JP)
Patent business corporation patent firm Sykes (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: INSULATION DETERIORATION MONITOR DEVICE

Next Patent: POLYAMIC ACID, POLYAMIDE, RESIN FILM, AND METAL-CLAD LAMINATE