Title:
COMPOSITION, TRANSFER FILM, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING CIRCUIT WIRING, AND METHOD FOR PRODUCING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/261469
Kind Code:
A1
Abstract:
The present invention addresses a first problem of providing a composition having excellent coatability. The present invention addresses a second problem of providing a transfer film, a method for producing a laminate, a method for producing a circuit wiring, and a method for producing an electronic device, with regard to said composition. This composition contains a resin and a compound A having at least one specific structure selected from the group consisting of (a), (b), and (c). (a) a perfluoroalkenyl group, (b) a perfluoropolyether group, (c) a group represented by general formula (C1): *-Cm＋Am-[-Lm-(Rf)m2]m1 or general formula (C2): *-An-Cn＋[-Ln-(Rf)n2]n1
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Inventors:
YAMADA SATORU (JP)
TAMURA AKIO (JP)
MOROZUMI KAZUMASA (JP)
SHIMOYAMA TATSUYA (JP)
TAMURA AKIO (JP)
MOROZUMI KAZUMASA (JP)
SHIMOYAMA TATSUYA (JP)
Application Number:
PCT/JP2021/023525
Publication Date:
December 30, 2021
Filing Date:
June 22, 2021
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C08L101/00; C08F290/06; C08L33/16; G03F7/004; H05K3/06
Domestic Patent References:
| WO2020106467A1 | 2020-05-28 | |||
| WO2018008376A1 | 2018-01-11 |
Foreign References:
| JP2016206275A | 2016-12-08 | |||
| JPH07146649A | 1995-06-06 | |||
| JP2003263077A | 2003-09-19 | |||
| JP2009198689A | 2009-09-03 | |||
| JP2004531617A | 2004-10-14 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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