COMPOSITION AND USE THEREOF, LEVELING AGENT, AND PREPARATION METHOD

Title:

COMPOSITION AND USE THEREOF, LEVELING AGENT, AND PREPARATION METHOD

Document Type and Number:

WIPO Patent Application WO/2024/046398

Kind Code:

A1

Abstract:

A composition. The composition comprises a metal ion source and a leveling agent as represented by formula (I), i.e., R1-S-(R3-O)m-(R2-O)n-R2-(O-R3)m-S-R1 , wherein each R1 group is independently selected from a substituted or unsubstituted nitrogen-containing heterocyclic group, each R2 group is independently a substituted or unsubstituted chain alkylene group, each R3 group is independently a substituted or unsubstituted chain alkylene group, m is 0 or 1, and n is an integer greater than or equal to 2. The composition is applied to metal filling of through holes in electronic substrates, can achieve uniform filling of through holes having different hole diameters, and achieves a low surface metal layer thickness and a small dimple value.

Inventors:

ZHENG LI (CN)
HAN ZUOYAN (CN)
XIAO NING (CN)
DING SHENGTAO (CN)

Application Number:

PCT/CN2023/115957

Publication Date:

March 07, 2024

Filing Date:

August 30, 2023

Export Citation:

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Assignee:

HUAWEI TECH CO LTD (CN)

International Classes:

C25D3/38; C08G65/334; H01L21/08

Foreign References:

JP2018178222A	2018-11-15
CN1908240A	2007-02-07
CN103703167A	2014-04-02
CN111892706A	2020-11-06
CN107326404A	2017-11-07
US6709562B1	2004-03-23

Attorney, Agent or Firm:

SCIHEAD IP LAW FIRM (CN)

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