Title:
COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2018/110666
Kind Code:
A1
Abstract:
Provided is a composition having a low curing shrinkage, which contains the components (A)-(D) described below.
(A) 100 parts by mass of an oligomer which has a (meth)acryloyl group, while having a diene skeleton or a hydrogenated diene skeleton
(B) more than 700 parts by mass of an oligomer which does not have a (meth)acryloyl group, while having a diene skeleton or a hydrogenated diene skeleton
(C) phenoxy alkylene glycol (meth)acrylate
(D) a photopolymerization initiator
Inventors:
TAKASAKI IPPEI (JP)
YUASA JUNICHI (JP)
NAKAJIMA GOSUKE (JP)
GOTO YOSHITSUGU (JP)
YUASA JUNICHI (JP)
NAKAJIMA GOSUKE (JP)
GOTO YOSHITSUGU (JP)
Application Number:
PCT/JP2017/044969
Publication Date:
June 21, 2018
Filing Date:
December 14, 2017
Export Citation:
Assignee:
DENKA COMPANY LTD (JP)
International Classes:
C08F290/00; B32B27/00; B32B27/30; C08J7/043; C08J7/046; C09J4/02; C09J11/06; C09J109/00
Domestic Patent References:
| WO2016039289A1 | 2016-03-17 |
Foreign References:
| JP2016060912A | 2016-04-25 | |||
| JP2015054938A | 2015-03-23 | |||
| JP2012144634A | 2012-08-02 | |||
| JP2014148606A | 2014-08-21 | |||
| JP2016147930A | 2016-08-18 | |||
| JP2016188386A | 2016-11-04 |
Attorney, Agent or Firm:
AXIS PATENT INTERNATIONAL (JP)
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