Title:
COMPOSITIONS, METHODS AND DEVICES FOR HIGH TEMPERATURE LEAD-FREE SOLDER
Document Type and Number:
WIPO Patent Application WO2002097145
Kind Code:
B1
Abstract:
A lead-free solder (130) comprises an alloy of silver and bismuth in amounts of 2wt% to 18wt% and 98wt% to 82wt%, respectively. Contemplated alloys have a solidus of no lower than 262.5 DEG C and a liquidus of no higher than 400 DEG C. Contemplated alloys may further comprise a chemical element with an oxygen affinity that is higher than the oxygen affinity of the alloy.
Inventors:
LALENA JOHN (US)
DEAN NANCY (US)
WEISER MARTIN (US)
DEAN NANCY (US)
WEISER MARTIN (US)
Application Number:
PCT/US2001/017491
Publication Date:
May 27, 2004
Filing Date:
May 28, 2001
Export Citation:
Assignee:
HONEYWELL INT INC (US)
LALENA JOHN (US)
DEAN NANCY (US)
WEISER MARTIN (US)
LALENA JOHN (US)
DEAN NANCY (US)
WEISER MARTIN (US)
International Classes:
B23K35/26; C22C5/02; C22C12/00; C22C13/00; C22C13/02; H01L21/60; B23K35/00; (IPC1-7): C22C13/00
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