Title:
COMPOUND CONTAINING PHENOLIC HYDROXYL GROUP, PHENOLIC RESIN, CURABLE COMPOSITION, CURED PRODUCT THEREOF, SEMICONDUCTOR SEALING MATERIAL, AND PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2014/199659
Kind Code:
A9
Abstract:
Provided are: a compound containing a phenolic hydroxyl group and having superior heat resistance and flame resistance of the cured product; a phenolic resin containing same; a curable composition and cured product thereof; a semiconductor sealing material; and a printed circuit board. The compound containing a phenolic hydroxyl group is characterized by having a molecular structure represented by general formula (I) [in the formula, X is a structural site represented by structural formula (x1) or (x2) {in formula (x1) and (x2), k is an integer from 1 to 3, m is 1 or 2, and Ar is a structural site represented by structural formula (Ar1) (in the formula, r is 1 or 2). When k or m is 2 or greater, the plurality of Ar groups may be the same or different}].
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Inventors:
SATOU YUTAKA (JP)
TAKAHASHI AYUMI (JP)
TAKAHASHI AYUMI (JP)
Application Number:
PCT/JP2014/054137
Publication Date:
January 21, 2016
Filing Date:
February 21, 2014
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C07C39/14; C07C37/14; C08G61/00; H01L23/29; H01L23/31
Attorney, Agent or Firm:
KONO MICHIHIRO (JP)
Michihiro Kono (JP)
Michihiro Kono (JP)
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