Title:
COMPOUND, METHOD FOR PRODUCING SAID COMPOUND, CURABLE MATERIAL, CURABLE COMPOSITION, METHOD FOR PRODUCING CURED ARTICLE, AND CURED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2024/070902
Kind Code:
A1
Abstract:
Provided is a compound represented by formula (1). (In the formula, R1 represents a hydrogen atom or a methyl group; R2 represents an alkyl group having 1 to 20 carbon atoms, an alkoxy group having 1 to 20 carbon atoms, an aryl group which may have a substituent, or a halogen atom; R3 represents a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, a hydroxymethyl group, a glycidyl ether group, a methyl glycidyl ether group, an acryloyloxymethyl group or a methacryloyloxymethyl group; R4 represents a hydrogen atom or a methyl group; the substituent is a group selected from an alkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms and a halogen atom; and n represents a numerical value of 0 to 4.)
Inventors:
HASEGAWA YUI (JP)
KOBAYASHI SHOTA (JP)
TAMASO KEN-ICHI (JP)
KOBAYASHI SHOTA (JP)
TAMASO KEN-ICHI (JP)
Application Number:
PCT/JP2023/034362
Publication Date:
April 04, 2024
Filing Date:
September 21, 2023
Export Citation:
Assignee:
ADEKA CORP (JP)
International Classes:
C07D407/12; C08F20/32; C08G59/20
Foreign References:
CN111704711A | 2020-09-25 | |||
JPS6099181A | 1985-06-03 | |||
JP2009149649A | 2009-07-09 | |||
JP2010013507A | 2010-01-21 | |||
US20200048301A1 | 2020-02-13 | |||
JP2023110567A | 2023-08-09 |
Attorney, Agent or Firm:
SHOWA INTERNATIONAL PATENT FIRM (JP)
Download PDF: