Title:
COMPOUND, POLYMERIZABLE COMPOSITION, AND CURED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2023/048228
Kind Code:
A1
Abstract:
Provided is a compound represented by general formula (1). In general formula (1), P1 represents a polymer structure comprising a sub-structure represented by general formula (2). In general formula (2), n is 1 or greater; when n1 is 1, X1 represents a monovalent organic group, X2 represents a bivalent organic group, Y1 represents a branched bivalent hydrocarbon group, and a ring may be formed by Y1 and X1 or X2, with this ring being a ring of four members or more; and when n1 is 2 or greater, X1 represents a hydrogen atom or a monovalent organic group, X2 represents a bivalent organic group, Y1 represents a bivalent organic group, one or more Y1 represents a branched bivalent organic group, and a ring may be formed by Y1 and X1 or X2.
Inventors:
HAYASHI DAISUKE (JP)
TAKAHASHI KEITA (JP)
TAKAHASHI KEITA (JP)
Application Number:
PCT/JP2022/035369
Publication Date:
March 30, 2023
Filing Date:
September 22, 2022
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C08F20/12; C07D251/34; C07D307/12; C08F2/44; C08F299/02
Foreign References:
| JP2014062222A | 2014-04-10 | |||
| JP2007277514A | 2007-10-25 | |||
| JP5454126B2 | 2014-03-26 | |||
| US9044902B2 | 2015-06-02 |
Attorney, Agent or Firm:
SIKS & CO. (JP)
Download PDF: