Title:
COMPOUND, PRODUCTION METHOD FOR SAID COMPOUND, LEVELING AGENT, COATING COMPOSITION, RESIST COMPOSITION, AND ARTICLE
Document Type and Number:
WIPO Patent Application WO/2023/171186
Kind Code:
A1
Abstract:
Provided is a compound that is capable of functioning as a leveling agent that imparts high smoothness and an effect of inhibiting pin unevenness to a coating film. Specifically, the compound has polymer blocks of polymerizable monomers at both terminals of a silicone chain. The level of dispersion (Mw/Mn), which is the ratio of the weight-average molecular weight to the number-average molecular weight of the compound, is in the range of 1.0-2.0.
Inventors:
FUJIWARA RYUTA (JP)
UENO JUNPEI (JP)
UENO JUNPEI (JP)
Application Number:
PCT/JP2023/003306
Publication Date:
September 14, 2023
Filing Date:
February 02, 2023
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C08F293/00; C09D7/47; C09D153/02; C09D201/00; G03F7/004
Foreign References:
| CN101983976A | 2011-03-09 | |||
| JPH0397735A | 1991-04-23 | |||
| JP2000514479A | 2000-10-31 | |||
| CN105713157A | 2016-06-29 |
Attorney, Agent or Firm:
ONO Takayuki (JP)
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