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Title:
COMPOUND FOR RARE EARTH ELEMENT BASED BONDED MAGNET AND BONDED MAGNET USING THE SAME
Document Type and Number:
WIPO Patent Application WO/2003/044811
Kind Code:
A1
Abstract:
A compound for a rare earth element based bonded magnet containing a rare earth element powder and a binding agent, characterized in that the rare earth element powder comprises, in an amount of 2 mass % or more, Ti−containing nanocomposite magnet powdery particles which have a composition represented by the empirical formula: (Fe1−mTm)100−x−y−z QxR yMz wherein T is at least one element selected from the group consisting of Co and Ni, Q is at least one element being selected from the group consisting of B and C and including B, R is at least one rare earth element not including La nor Ce, M is at least one metal element being selected from the group consisting of Ti, Zr and Hf and including Ti, and x, y, z and m respectively satisfy 10 < x ≤ 20 atomic %, 6 ≤ y < 10 atomic %, 0.1 ≤ z ≤ 12 atomic % and 0 ≤ m ≤ 0.5, and have a structure containing two or more types of ferromagnetic crystal phase, wherein a hard magnetic phase has an average crystal grain diameter of 10 nm to 200 nm, a soft magnetic phase has an average crystal grain diameter of 1 nm to 100 nm, and the average crystal grain diameter of the soft magnetic phase is less than that of the hard magnetic phase.

Inventors:
NISHIUCHI TAKESHI (JP)
KANEKIYO HIROKAZU (JP)
HIROSAWA SATOSHI (JP)
MIYOSHI TOSHIO (JP)
Application Number:
PCT/JP2002/012033
Publication Date:
May 30, 2003
Filing Date:
November 18, 2002
Export Citation:
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Assignee:
SUMITOMO SPEC METALS (JP)
NISHIUCHI TAKESHI (JP)
KANEKIYO HIROKAZU (JP)
HIROSAWA SATOSHI (JP)
MIYOSHI TOSHIO (JP)
International Classes:
B22F1/00; B22F3/00; C22C1/04; C22C38/00; B22F9/04; C22C38/14; H01F1/053; H01F1/057; H01F1/08; (IPC1-7): H01F1/04; H01F1/08; B22F1/00; C22C38/00
Foreign References:
JPS647502A1989-01-11
JPH06338407A1994-12-06
JP2001244107A2001-09-07
JPH07226312A1995-08-22
JPH1053844A1998-02-24
Other References:
See also references of EP 1447823A4
Attorney, Agent or Firm:
Okuda, Seiji (Kataoka Bldg. 3-6 Uchiawajimachi 1-chome Chuo-ku Osaka-shi, Osaka, JP)
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