Title:
COMPOUND SUPERCONDUCTING PRECURSOR WIRE, COMPOUND SUPERCONDUCTING PRECURSOR STRAND, AND COMPOUND SUPERCONDUCTING STRAND
Document Type and Number:
WIPO Patent Application WO/2023/189275
Kind Code:
A1
Abstract:
This compound superconducting precursor wire has: a compound superconducting precursor part composed of a plurality of compound superconducting precursor filaments and a first matrix precursor in which the plurality of compound superconducting precursor filaments is embedded and which includes a first stabilizing material; a reinforcing material part disposed on the outer peripheral side of the compound superconducting precursor part; and a stabilizing material part which is disposed on at least one of the inner peripheral side and the outer peripheral side of the reinforcing material part and is formed from a second stabilizing material. The Vickers hardness (HV) of the stabilizing material part is 90 or less, and the 0.2% tensile proof stress of the compound superconducting precursor wire is 200 MPa or more.
Inventors:
SUGIMOTO MASAHIRO (JP)
HIROSE KIYOSHIGE (JP)
FUKUSHIMA HIROYUKI (JP)
TANIGUCHI RYO (JP)
AWAJI SATOSHI (JP)
OGURO HIDETOSHI (JP)
HIROSE KIYOSHIGE (JP)
FUKUSHIMA HIROYUKI (JP)
TANIGUCHI RYO (JP)
AWAJI SATOSHI (JP)
OGURO HIDETOSHI (JP)
Application Number:
PCT/JP2023/008522
Publication Date:
October 05, 2023
Filing Date:
March 07, 2023
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
UNIV TOHOKU (JP)
TOKAI UNIV EDUCATIONAL SYSTEM (JP)
UNIV TOHOKU (JP)
TOKAI UNIV EDUCATIONAL SYSTEM (JP)
International Classes:
H01B12/10
Domestic Patent References:
| WO2020066907A1 | 2020-04-02 | |||
| WO2013154187A1 | 2013-10-17 |
Foreign References:
| JPH0982149A | 1997-03-28 | |||
| JPH07141930A | 1995-06-02 |
Attorney, Agent or Firm:
KURUMA Kiyoshi et al. (JP)
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