Title:
COMPRESSION MOLDING DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/255021
Kind Code:
A1
Abstract:
A compression molding device (1) compression molds a resin (R) to a workpiece (10) in which a plurality of components (12) are mounted on a carrier (11) via a plurality of connection members, and produces a plurality of packages each having at least one of the components (12) resin sealed therein. The compression molding device (1) comprises: a measuring unit (110) that measures the weight of the workpiece (10); a calculation unit (120) that calculates the supply quantity of the resin (R) on the basis of the weight of the workpiece (10) measured by the measuring unit (110); a supply unit (130) that supplies the resin (R) in the supply quantity calculated by the calculation unit (120); and a molding die (190) that is used for compression molding, to the workpiece (10), the resin (R) supplied by the supply unit (130). The calculation unit (120) calculates the total volume of a plurality of mounted articles including the plurality of components (12) and the plurality of connection members on the basis of the weight of the workpiece (10) and calculates the supply quantity of the resin on the basis of the total volume of the plurality of mounted articles.
Inventors:
YANAGISAWA MAKOTO (JP)
TAGAMI SHUSAKU (JP)
TAGAMI SHUSAKU (JP)
Application Number:
PCT/JP2022/019416
Publication Date:
December 08, 2022
Filing Date:
April 28, 2022
Export Citation:
Assignee:
APIC YAMADA CORP (JP)
International Classes:
H01L21/56; B29C31/06; B29C43/18; B29C43/34; B29C43/58
Foreign References:
| JP2003165133A | 2003-06-10 | |||
| JP2003258172A | 2003-09-12 | |||
| JP2003231145A | 2003-08-19 | |||
| JP2009088403A | 2009-04-23 | |||
| JP2017226202A | 2017-12-28 | |||
| JP2019145550A | 2019-08-29 | |||
| JP2010040939A | 2010-02-18 |
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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