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Patent Searching and Data


Title:
COMPRESSION MOLDING DIE, PRODUCTION METHOD FOR COMPRESSION MOLDING DIE, AND PRODUCTION METHOD FOR COMPRESSION-MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2015/151825
Kind Code:
A1
Abstract:
A compression molding die for pressurizing and compressing a material for organic EL elements and forming a compression-molded article. A nitride film including a nitride is laminated on a metal surface of the compression molding die that comes in contact with the material for organic EL elements during compression and a fluoride film including a fluoride formed by an immersion method is laminated on the nitride film.

Inventors:
SHIGEHISA HIROMARO (JP)
FUKUDA MASAHIKO (JP)
Application Number:
PCT/JP2015/058182
Publication Date:
October 08, 2015
Filing Date:
March 19, 2015
Export Citation:
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Assignee:
IDEMITSU KOSAN CO (JP)
International Classes:
B29C33/38; B29C43/02; B29C43/36; B30B11/02; H01L51/50; H05B33/10
Foreign References:
JP2004273456A2004-09-30
JP2000061952A2000-02-29
JPH03272815A1991-12-04
JPH03254910A1991-11-13
JP2002001733A2002-01-08
JP2008112977A2008-05-15
JPH03216298A1991-09-24
JP2012056246A2012-03-22
Attorney, Agent or Firm:
KINOSHITA & ASSOCIATES (JP)
Bottom intellectual property office of patent business corporation Tatsuyuki (JP)
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