Title:
COMPUTER, PARAMETER ESTIMATION PROCESSING METHOD, AND PARAMETER ESTIMATION PROCESSING PROGRAM
Document Type and Number:
WIPO Patent Application WO/2022/118709
Kind Code:
A1
Abstract:
The present invention makes it easy to estimate the value of a prescribed parameter used in a dynamics simulation for creating or modifying a machining program executed by a machine tool, or for cutting process design. A cloud server 10 for estimating the value of a prescribed parameter used in a dynamics simulation for creating or modifying a machining program executed by a machine tool 20, or for cutting process design, includes a processor 14, wherein the prescribed parameter relates to a tool used by the machine tool 20 or to the equipment of the machine tool 20, and the processor 14 is configured to: (A) transmit trial cutting data for trial cutting of a prescribed test piece for estimating the prescribed parameter; (B) acquire shape data relating to the shape of the test piece after the test piece has been subjected to the trial cutting by the machine tool, on the basis of the trial cutting data; and (C) estimate the prescribed parameter on the basis of the acquired shape data.
More Like This:
Inventors:
YAMADA YU (JP)
KONO IPPEI (JP)
SANO YASUSHI (JP)
KEDO YASUTAKA (JP)
KONO IPPEI (JP)
SANO YASUSHI (JP)
KEDO YASUTAKA (JP)
Application Number:
PCT/JP2021/042998
Publication Date:
June 09, 2022
Filing Date:
November 24, 2021
Export Citation:
Assignee:
HITACHI LTD (JP)
International Classes:
G05B19/404; B23Q15/00; G16Y10/25
Domestic Patent References:
WO2009057229A1 | 2009-05-07 |
Foreign References:
JP2002230317A | 2002-08-16 | |||
JP2004181566A | 2004-07-02 | |||
JP2020184321A | 2020-11-12 | |||
JP2010237843A | 2010-10-21 | |||
US7050883B2 | 2006-05-23 | |||
JP2021088024A | 2021-06-10 |
Attorney, Agent or Firm:
WILLFORT INTERNATIONAL PATENT FIRM (JP)
Download PDF:
Previous Patent: SMAS EVALUATION METHOD, COMPUTER, AND PROGRAM
Next Patent: TRANSPARENT GAS BARRIER FILM
Next Patent: TRANSPARENT GAS BARRIER FILM