Title:
CONDUCTIVE ADHESIVE LAYER AND HEAT DISSIPATION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2023/190423
Kind Code:
A1
Abstract:
Provided is a conductive adhesive layer having sufficiently high heat dissipation properties in the thickness direction while maintaining electromagnetic wave shielding properties. This conductive adhesive layer comprises a binder component and conductive particles, and is characterized in that: the conductive particles include first particles and second particles having a median diameter smaller than that of the first particles; the second particles are flaky particles obtained by covering the core particles with a metal layer; and the ratio of the mass of the conductive particles to the mass of the conductive adhesive layer is 60 to 90 mass%.
Inventors:
NAGATAKE TOMOHIRO (JP)
TAJIMA HIROSHI (JP)
HARUNA YUUSUKE (JP)
TAJIMA HIROSHI (JP)
HARUNA YUUSUKE (JP)
Application Number:
PCT/JP2023/012356
Publication Date:
October 05, 2023
Filing Date:
March 28, 2023
Export Citation:
Assignee:
TATSUTA ELECTRIC WIRE & CABLE CO LTD (JP)
International Classes:
H05K9/00; H01B1/00; H01B1/22; H05K7/20
Domestic Patent References:
| WO2018043505A1 | 2018-03-08 | |||
| WO2018147424A1 | 2018-08-16 | |||
| WO2007037440A1 | 2007-04-05 |
Foreign References:
| JPH11167812A | 1999-06-22 | |||
| JP2017175080A | 2017-09-28 |
Attorney, Agent or Firm:
WISEPLUS IP FIRM (JP)
Download PDF: