Title:
CONDUCTIVE ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2007/052661
Kind Code:
A1
Abstract:
Disclosed is a conductive adhesive which prevents migration and sulfuration of a metal component during mounting of electronic components. Such a conductive adhesive is obtained by dispersing metal filler particles in a thermosetting resin. As the metal filler particles, there can be used those metal filler particles composed of an alloy of Ag and at least one metal selected from the group consisting of Sn, Cu, In, Bi and Ni; a mixture of such metal filler particles and Ag filler particles; or those metal filler particles which are obtained by forming a coating layer of a metal such as Sn on the surfaces of Ag filler particles.
Inventors:
YAMAGUCHI ATSUSHI
MIYAKAWA HIDENORI
HIGUCHI TAKAYUKI
MATSUNO KOSO
TSUJIMURA HIDEYUKI
MIYAKAWA HIDENORI
HIGUCHI TAKAYUKI
MATSUNO KOSO
TSUJIMURA HIDEYUKI
Application Number:
PCT/JP2006/321753
Publication Date:
May 10, 2007
Filing Date:
October 31, 2006
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD (JP)
YAMAGUCHI ATSUSHI
MIYAKAWA HIDENORI
HIGUCHI TAKAYUKI
MATSUNO KOSO
TSUJIMURA HIDEYUKI
YAMAGUCHI ATSUSHI
MIYAKAWA HIDENORI
HIGUCHI TAKAYUKI
MATSUNO KOSO
TSUJIMURA HIDEYUKI
International Classes:
C09J201/00; C09J9/02; H01B1/22; H05K3/32
Foreign References:
| JP2002265920A | 2002-09-18 | |||
| US20050230667A1 | 2005-10-20 | |||
| JP2001294844A | 2001-10-23 | |||
| JP2006294600A | 2006-10-26 | |||
| JP2005194306A | 2005-07-21 |
Attorney, Agent or Firm:
TANAKA, Mitsuo et al. (IMP Building 3-7, Shiromi 1-chome, Chuo-ku, Osaka-sh, Osaka 01, JP)
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