Title:
CONDUCTIVE COATING MATERIAL HAVING GOOD ADHESIVENESS TO METAL OXIDE MOLDING
Document Type and Number:
WIPO Patent Application WO/1995/006092
Kind Code:
A1
Abstract:
A conductive coating material having good solderability and adhesiveness without the necessity for accurately controlling the hardening condition. It is prepared by kneading a mixture of 100 parts by weight of a silver-plated copper powder (with a silver content of 30 wt.% or less) with 13.6-6.0 parts by weight (in terms of solid content) of a phenolic resin satisfying the requirement (1) which will be described hereinafter, 0.2-0.7 part by weight of a coupling agent containing a saturated fatty acid, 1.0-4.0 parts by weight of triethanolamine, 0.1-1.0 part by weight of dihydroxybenzene, a suitable amount of a defoamer, and a suitable amount of a solvent mixture consisting of 9.5-8.0 parts by weight by butyl carbitol and 0.5-2.0 parts by weight of acetylacetone: requirement (1): (i) l/n = 0.8-1.2, (ii) m/n = 0.8-1.2, (iii) b/a = 0.8-1.2, and (iv) c/a = 1.2-1.5, wherein l, m, n, a, b, and c represent the infrared transmittances of, respectively, a 2-monosubstituted derivative, 2,4-disubstituted derivative, 2,4,6-trisubstituted derivative, methylol group, dimethylene ether group, and phenyl group.
Inventors:
WAKITA SHINICHI (JP)
Application Number:
PCT/JP1994/001401
Publication Date:
March 02, 1995
Filing Date:
August 24, 1994
Export Citation:
Assignee:
TATSUTA DENSEN KK (JP)
WAKITA SHINICHI (JP)
WAKITA SHINICHI (JP)
International Classes:
C09D5/24; C09D161/04; C09D161/06; H01B1/22; H05K1/09; (IPC1-7): C09D5/24; C08G8/00; H01B1/22
Foreign References:
| JPH0477639A | 1992-03-11 | |||
| JPH0528829A | 1993-02-05 |
Other References:
See also references of EP 0666291A4
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