Title:
CONDUCTIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2017/022523
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a means which exhibits excellent heat resistance and mounting reliability when a semiconductor power element is bonded to a metal lead frame, and which is free from lead, thereby placing little burden on the environment.
Namely, a conductive composition that contains, as essential components, at least a sulfide compound represented by R-S-R' (wherein R is an organic group containing at least carbon; R' is an organic group that is the same as or different from the R moiety; and the R and R' moieties may combine with each other to form a so-called cyclic sulfide) and metal particles containing at least Cu, Sn or Ni.
A conductive paste and a conductive bonding film, each of which is produced using this conductive composition; and a dicing die bonding film which is obtained by bonding the conductive bonding film and an adhesive tape.
Inventors:
MIHARA NAOAKI (JP)
KIRIKAE NORIYUKI (JP)
SUGIYAMA JIROU (JP)
KIRIKAE NORIYUKI (JP)
SUGIYAMA JIROU (JP)
Application Number:
PCT/JP2016/071556
Publication Date:
February 09, 2017
Filing Date:
July 22, 2016
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
H01B1/22; C09J7/10; C09J7/35; C09J9/02; C09J11/04; C09J11/06; C09J163/00; C09J179/04; C09J201/00; H01L21/52
Domestic Patent References:
| WO2009057530A1 | 2009-05-07 |
Foreign References:
| JPH10261319A | 1998-09-29 | |||
| JP2004355933A | 2004-12-16 | |||
| JP2004189954A | 2004-07-08 | |||
| JP2014049621A | 2014-03-17 | |||
| JP2010221260A | 2010-10-07 | |||
| JP5989928B1 | 2016-09-07 |
Other References:
See also references of EP 3333856A4
Attorney, Agent or Firm:
INOUE, Seiichi (JP)
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