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Patent Searching and Data


Title:
CONDUCTIVE CONNECTION MATERIAL, METHOD FOR CONNECTION BETWEEN TERMINALS AND METHOD FOR MANUFACTURING CONNECTING TERMINAL
Document Type and Number:
WIPO Patent Application WO/2011/040442
Kind Code:
A1
Abstract:
Disclosed is a conductive connection material which has a laminated structure comprising a resin composition and metal foil selected from solder foil or tin foil. The resin composition of the conductive connection material has a minimum ion viscosity value of 4 to 9, measured by applying a frequency of 10,000 Hz at the melting point of the metal foil, in compliance with ASTM standard E2039. Further disclosed are a method for connection between terminals using the conductive connection material and a method for manufacturing a connecting terminal. Excellent electrical connection between connecting terminals and high insulation reliability between adjacent terminals can be obtained by employing the conductive connection material.

Inventors:
CHUMA TOSHIAKI (JP)
OKADA WATARU (JP)
KAGIMOTO TOMOHIRO (JP)
Application Number:
PCT/JP2010/066914
Publication Date:
April 07, 2011
Filing Date:
September 29, 2010
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO (JP)
CHUMA TOSHIAKI (JP)
OKADA WATARU (JP)
KAGIMOTO TOMOHIRO (JP)
International Classes:
C09J201/00; C09J7/28; C09J9/02; C09J11/04; C09J11/06; C09J133/02; C09J163/00; C09J171/10; C09J179/08; H01B5/16; H01L21/60; H01R11/01; H01R43/00; H05K1/14; H05K3/32; H05K3/36
Foreign References:
JP2000219865A2000-08-08
JP2007039567A2007-02-15
JPS61276873A1986-12-06
JP2004260131A2004-09-16
Attorney, Agent or Firm:
KOBAYASHI Hiroshi et al. (JP)
Kobayashi 浩 (JP)
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