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Title:
CONDUCTIVE EPOXY RESIN COMPOSITION FOR COPPER BONDING
Document Type and Number:
WIPO Patent Application WO/2022/011494
Kind Code:
A1
Abstract:
Disclosed is a conductive epoxy resin composition, in particular for bonding copper substrate, and the cured product, and the use thereof as well as a semiconductor device comprising the cured product.

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Inventors:
TI YANG (CN)
YAO WEI (CN)
WU QILI (CN)
ZHAO JIAWEN (CN)
Application Number:
PCT/CN2020/101576
Publication Date:
January 20, 2022
Filing Date:
July 13, 2020
Export Citation:
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Assignee:
HENKEL AG & CO KGAA (DE)
ABLESTIK SHANGHAI LTD (CN)
International Classes:
C08G59/14; C08G59/22; C08G59/38; C09J9/02; C09J163/00
Domestic Patent References:
WO2011008295A12011-01-20
WO2003040251A12003-05-15
Foreign References:
CN107586520A2018-01-16
CN109913080A2019-06-21
CN111087843A2020-05-01
Attorney, Agent or Firm:
NTD PATENT AND TRADEMARK AGENCY LIMITED (CN)
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