Title:
CONDUCTIVE FILM MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2019/124420
Kind Code:
A1
Abstract:
The present invention pertains to a method for manufacturing a conductive film by forming a coating of a composition containing conductivity-imparting particles, and by performing photo-sintering on said coating, wherein the coating is compressed in the thickness direction thereof prior to the photo-sintering. It is preferable to compress the coating at a temperature that causes a binding agent in the composition to exhibit a storage elastic modulus of not more than 100 MPa. It is also preferable to compress the coating so as to have a compression ratio of 25-80% in the thickness direction thereof. In the photo-sintering step, the irradiation of light is preferably carried out using pulsed light.
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Inventors:
ANAI KEI (JP)
FUKUZATO SHUN (JP)
FUKUZATO SHUN (JP)
Application Number:
PCT/JP2018/046717
Publication Date:
June 27, 2019
Filing Date:
December 19, 2018
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO (JP)
International Classes:
H01B13/00; C09D5/24; C09D201/00; C23C26/00; H01B1/22
Domestic Patent References:
| WO2017130812A1 | 2017-08-03 |
Foreign References:
| JP2017066269A | 2017-04-06 | |||
| JP2017069012A | 2017-04-06 |
Other References:
See also references of EP 3731244A4
Attorney, Agent or Firm:
SHOWA INTERNATIONAL PATENT FIRM (JP)
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