Title:
CONDUCTIVE FILM, CONDUCTIVE PASTE, AND PRODUCTION METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2021/241767
Kind Code:
A1
Abstract:
The present invention comprises the steps of: applying, on a substrate, a conductive paste including metal particles that are dispersed in an organic material and have a first particle diameter, and a magnetic heating element that has a second particle diameter; and selectively sintering the applied conductive paste by induction heating to form a conductive film, wherein the magnetic heating element may be contained in an amount of 10-50 wt% with respect to the metal particles. Therefore, a conductive adhesive layer can be selectively formed by performing the sintering through induction heating. In addition, by adding a small amount of the magnetic heating element to conductive metal powder having a low melting point, low-temperature bonding and electric conductivity can be simultaneously attained.
Inventors:
KIM SOONGIL (KR)
KIM HONGJUNG (KR)
KIM JONGDEOK (KR)
KIM HONGJUNG (KR)
KIM JONGDEOK (KR)
Application Number:
PCT/KR2020/006782
Publication Date:
December 02, 2021
Filing Date:
May 26, 2020
Export Citation:
Assignee:
LG ELECTRONICS INC (KR)
International Classes:
H01B1/22; H01B5/14; H05K3/12
Domestic Patent References:
| WO2001008304A1 | 2001-02-01 | |||
| WO1991011081A1 | 1991-07-25 |
Foreign References:
| US20040129924A1 | 2004-07-08 | |||
| KR20170075891A | 2017-07-04 | |||
| US20170198116A1 | 2017-07-13 | |||
| US20090127253A1 | 2009-05-21 |
Attorney, Agent or Firm:
PARK, Byung Chang (KR)
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