Title:
CONDUCTIVE INK FOR COPPER-NICKEL ALLOY ELECTRODES, COPPER-NICKEL ALLOY ELECTRODE-BEARING SUBSTRATE, AND THEIR METHODS OF PRODUCTION
Document Type and Number:
WIPO Patent Application WO/2022/130892
Kind Code:
A1
Abstract:
The present invention provides a conductive ink for copper-nickel alloy electrodes, a copper-nickel alloy electrode-bearing substrate, and their methods of production. A conductive ink for copper-nickel alloy electrodes according to the present invention comprises a copper complex given by Cu(HCOO)2(L1)m and a nickel complex given by Ni(HCOO)2(L2)n, wherein the proportion of the nickel with respect to the total mass of the contained copper and nickel is in the range from at least 5 mass% to less than 80 mass%. Here, m and n are each natural numbers from 2-4, and each L1 is the same or a different amino alcohol having one amino group and each L2 is the same or a different aliphatic amine having one amino group, or the reverse is true.
Inventors:
LI WANLI (JP)
MINARI TAKEO (JP)
MINARI TAKEO (JP)
Application Number:
PCT/JP2021/042517
Publication Date:
June 23, 2022
Filing Date:
November 19, 2021
Export Citation:
Assignee:
NAT INST MATERIALS SCIENCE (JP)
International Classes:
B22F9/00; C09D11/52; H01B1/22; H05K1/09
Foreign References:
| JP2016183296A | 2016-10-20 | |||
| JP2005537386A | 2005-12-08 | |||
| JP2016141860A | 2016-08-08 | |||
| JP2014162966A | 2014-09-08 | |||
| JP2017107524A | 2017-06-15 | |||
| JP2013125655A | 2013-06-24 | |||
| JP2014139893A | 2014-07-31 |
Attorney, Agent or Firm:
TSUZUKI Noriaki (JP)
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