Title:
CONDUCTIVE LAMINATE, TOUCH PANEL, AND METHOD FOR MANUFACTURING CONDUCTIVE LAMINATE
Document Type and Number:
WIPO Patent Application WO/2020/195370
Kind Code:
A1
Abstract:
Provided is a conductive laminate for which the disconnection of fine metal wiring when left standing in a high temperature environment is suppressed. Also provided are a touch panel and a method for manufacturing the conductive laminate. The conductive laminate comprises a first organic film, fine metal wiring disposed on the first organic film, and a second organic film disposed so as to cover the fine metal wiring. The fine metal wiring includes, in order from the first organic film side, a blackened layer, an adhesion layer, and a metal conductive layer. The water content percentage of the first organic film and the second organic film is less than 3.00%.
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Inventors:
INOUE DAISUKE (JP)
Application Number:
PCT/JP2020/006546
Publication Date:
October 01, 2020
Filing Date:
February 19, 2020
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
B32B17/10; B32B7/025; B32B15/02; B32B15/04; B32B15/20; G06F3/041; G06F3/044; H01B5/14; H01B13/00
Domestic Patent References:
| WO2013099776A1 | 2013-07-04 | |||
| WO2018163565A1 | 2018-09-13 |
Foreign References:
| JP2017211826A | 2017-11-30 | |||
| JP2014150118A | 2014-08-21 |
Other References:
ANONYMOUS: "2. Effect of moisture percentage", DELL PET TECHNICAL INFORMATION, 24 March 2020 (2020-03-24), pages 1 - 8, XP009523841, Retrieved from the Internet
Attorney, Agent or Firm:
NAKASHIMA Junko et al. (JP)
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