Title:
CONDUCTIVE LAYER FABRICATION METHOD AND PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2014/041956
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a conductive layer fabrication method that can form a conductive layer with excellent conductivity, and to provide a printed circuit board using this conductive layer. This conductive layer fabrication method is provided with a reducing step in which a precursor-layer-equipped supporting medium, which has a support medium and a precursor layer disposed on the support medium and containing particles of copper oxide, is subjected to photo irradiation which reduces the particles of copper oxide, thereby forming a conductive layer containing metallic copper. The filling rate of the particles of copper oxide of the precursor layer is at least 65%.
Inventors:
OHTA HIROSHI (JP)
Application Number:
PCT/JP2013/071944
Publication Date:
March 20, 2014
Filing Date:
August 15, 2013
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
H01B13/00; H05K3/10; B22F7/04
Domestic Patent References:
| WO2008114866A1 | 2008-09-25 | |||
| WO2013077448A1 | 2013-05-30 |
Foreign References:
| JPH0537126A | 1993-02-12 | |||
| JP2011074485A | 2011-04-14 | |||
| JP2010528428A | 2010-08-19 | |||
| JP2012153820A | 2012-08-16 |
Attorney, Agent or Firm:
WATANABE Mochitoshi et al. (JP)
Mochitoshi Watanabe (JP)
Mochitoshi Watanabe (JP)
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