CONDUCTIVE LIQUID METAL MICROPARTICLES COMPRISING HYDROGEN-DOPED LIQUID METAL OXIDE, CONDUCTIVE INK COMPRISING SAME, AND PREPARATION METHOD THEREFOR

Title:

CONDUCTIVE LIQUID METAL MICROPARTICLES COMPRISING HYDROGEN-DOPED LIQUID METAL OXIDE, CONDUCTIVE INK COMPRISING SAME, AND PREPARATION METHOD THEREFOR

Document Type and Number:

WIPO Patent Application WO/2021/187724

Kind Code:

A1

Abstract:

Disclosed are conductive liquid metal microparticles comprising a hydrogen-doped liquid metal oxide, a conductive ink comprising same, and a preparation method therefor. The conductive liquid metal microparticles comprise: a core comprising a liquid metal; and a shell encompassing the core and comprising a hydrogen-doped liquid metal oxide, and the conductive ink comprises the liquid metal microparticles so as to form a circuit line, which has metal conductivity, shows a change in resistance that can be disregarded when deformation or mechanical damage is present, and has electrical stability in a poor environment condition and excellent adhesiveness to an elastic substrate.

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Inventors:

JEONG UNYONG (KR)
SELVARAJ VEERAPANDIAN (KR)

Application Number:

PCT/KR2020/018245

Publication Date:

September 23, 2021

Filing Date:

December 14, 2020

Export Citation:

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Assignee:

POSTECH RES & BUSINESS DEV FOUND (KR)

International Classes:

C09D11/52; C09D11/03; C09D11/10

Domestic Patent References:

WO2018194517A1

2018-10-25

Foreign References:

KR20190069081A	2019-06-19
KR20180092471A	2018-08-20
KR20150109374A	2015-10-01
KR20170025313A	2017-03-08

Other References: