Title:
CONDUCTIVE MATERIAL AND CONNECTED STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2014/189028
Kind Code:
A1
Abstract:
Provided is a conductive material which has a high reaction rate and a high fluxing effect. The conductive material according to the invention comprises conductive particles (1), at least the outer surface of which is a solder, an anionically curable compound, an anionic hardener, and an organic acid having a carboxyl group and a functional group formed by esterification of a carboxyl group.
Inventors:
ISHIZAWA HIDEAKI (JP)
KUBOTA TAKASHI (JP)
KUBOTA TAKASHI (JP)
Application Number:
PCT/JP2014/063290
Publication Date:
November 27, 2014
Filing Date:
May 20, 2014
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C08L101/02; B22F1/18; C08K5/10; C08K9/02; C08L63/00; H01B1/00; H01B1/22; H01B5/16; H01R11/01; B22F1/102; B22F1/16; B22F1/17
Domestic Patent References:
| WO2012102079A1 | 2012-08-02 | |||
| WO2006064849A1 | 2006-06-22 |
Foreign References:
| JP2011016967A | 2011-01-27 | |||
| JP2009263499A | 2009-11-12 | |||
| JP2009242716A | 2009-10-22 | |||
| JP2009263500A | 2009-11-12 | |||
| JP2008012576A | 2008-01-24 | |||
| JP2012216770A | 2012-11-08 | |||
| JP2003225795A | 2003-08-12 |
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
Patent business corporation Miyazaki and table-of-contents patent firm (JP)
Patent business corporation Miyazaki and table-of-contents patent firm (JP)
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