Title:
CONDUCTIVE METAL RESIN MULTILAYER BODY AND MOLDED BODY OF SAME
Document Type and Number:
WIPO Patent Application WO/2020/100489
Kind Code:
A1
Abstract:
The present invention provides a conductive metal resin multilayer body that comprises: a metal foil; and a resin layer which is arranged on at least one surface of the metal foil, and which contains a resin, organic fibers and a conductive filler that is formed of a non-metal material.
More Like This:
Inventors:
YASUDA KOSUKE (JP)
OKEI TAKEHIRO (JP)
ASHIZAKI SHOYA (JP)
OOYAGI REON (JP)
OKEI TAKEHIRO (JP)
ASHIZAKI SHOYA (JP)
OOYAGI REON (JP)
Application Number:
PCT/JP2019/040234
Publication Date:
May 22, 2020
Filing Date:
October 11, 2019
Export Citation:
Assignee:
NISSHINBO HOLDINGS INC (JP)
International Classes:
B32B15/08; B29C43/20; B29C43/34; B29C70/12; B29C70/42; B29C70/68; B32B27/04; B32B27/20; H01M8/0206; H01M8/0221; H01M8/0223; H01M8/0228; H01M8/0258; B29K101/10; B29K105/12; B29L9/00
Domestic Patent References:
| WO2001085849A1 | 2001-11-15 | |||
| WO2005027248A1 | 2005-03-24 | |||
| WO2005027248A1 | 2005-03-24 |
Foreign References:
| JP2000169126A | 2000-06-20 | |||
| JP2003297383A | 2003-10-17 | |||
| JP2009286964A | 2009-12-10 |
Other References:
See also references of EP 3882020A4
Attorney, Agent or Firm:
PATENT PROFESSIONAL CORPORATION EI-MEI PATENT OFFICE (JP)
Download PDF: