CONDUCTIVE MICROPARTICLE, RESIN PARTICLE, AND ANISOTROPIC CONDUCTIVE MATERIAL USING SAME

Title:

CONDUCTIVE MICROPARTICLE, RESIN PARTICLE, AND ANISOTROPIC CONDUCTIVE MATERIAL USING SAME

Document Type and Number:

WIPO Patent Application WO/2012/102199

Kind Code:

A1

Abstract:

Provided is a conductive microparticle that has a low initial resistance value and can maintain a stable connected state while being a minute conductive microparticle. This conductive microparticle has a base material formed from a resin particle and at least one conductive metal layer formed on the surface of the base material. This conductive microparticle is characterized by the number-based average dispersed particle size for the resin particle being 1.0 - 2.5 µm and the modulus of compressive elasticity when the diameter of the resin particle is displaced 10% (10% K value) being 12,000 N/mm2 or greater.

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Inventors:

MATSUMOTO KAZUAKI (JP)
KOBAYASHI NAOKI (JP)
SASAKI YOSHIKUNI (JP)

Application Number:

PCT/JP2012/051184

Publication Date:

August 02, 2012

Filing Date:

January 20, 2012

Export Citation:

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Assignee:

NIPPON CATALYTIC CHEM IND (JP)
MATSUMOTO KAZUAKI (JP)
KOBAYASHI NAOKI (JP)
SASAKI YOSHIKUNI (JP)

International Classes:

H01B5/00; H01B5/16; H01R11/01

Foreign References:

JP2006040546A	2006-02-09
JP2007035575A	2007-02-08
JP2001216841A	2001-08-10
JP2001155539A	2001-06-08
JP2006107881A	2006-04-20
JP2009135086A	2009-06-18
JP2006269296A	2006-10-05

Attorney, Agent or Firm:

UEKI, Kyuichi et al. (JP)
Hisakazu Ueki (JP)

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Claims:

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