Title:
CONDUCTIVE MICROSPHERE FOR ANISOTROPIC CONDUCTIVE ADHESIVE FILM AND PREPARATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2022/002278
Kind Code:
A1
Abstract:
The present invention belongs to the field of conductive material preparation, and particularly relates to a conductive microsphere for an anisotropic conductive adhesive/film. A "core-shell" microsphere is made by using a monodisperse and highly cross-linked microsphere as a core base sphere, and then grafting a linear polymer onto the surface of the base sphere to form a soft-shell outer layer; and then, a "core-shell" conductive microsphere is made by means of the electroless plating of metals (nickel or silver) and the secondary electrochemical plating of gold on the surface of the microsphere. The invention effectively solves the problem that an existing ordinary conductive microsphere is broken under a large attaching pressure range, which causes a decrease in the number of effective conductive microspheres between electrodes and an increase in the contact resistance.
Inventors:
ZHANG JING (CN)
ZHENG GUODONG (CN)
ZHENG ZHENG (CN)
ZHENG GUODONG (CN)
ZHENG ZHENG (CN)
Application Number:
PCT/CN2021/109952
Publication Date:
January 06, 2022
Filing Date:
August 01, 2021
Export Citation:
Assignee:
TAIZHOU TIANSHU NEW MATERIAL TECH CO LTD (CN)
International Classes:
C08F257/00; C08F8/32; C08F212/12; C08F212/14; C08F212/36; C08F220/20; C08F220/32; C23C18/16; C23C18/30; C23C18/31
Foreign References:
| CN111718444A | 2020-09-29 | |||
| JP2003208813A | 2003-07-25 | |||
| CN111234657A | 2020-06-05 | |||
| CN102838709A | 2012-12-26 | |||
| CN101153080A | 2008-04-02 | |||
| CN103030728A | 2013-04-10 |
Other References:
JUN JUNG-BAE, MIN-SU SEO, SEONG-HEUN CHO, JIN-GYU PARK, JEE-HYUN RYU, KYUNG-DO SUH: "Synthesis of Monodisperse Nickel-Coated Polymer Particles by Electroless Plating Method Utilizing Functional Polymeric Ligands", JOURNAL OF APPLIED POLYMER SCIENCE, vol. 100, no. 5, 27 March 2006 (2006-03-27), pages 3801 - 3808, XP055883835, DOI: 10.1002/app.23807
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