Title:
CONDUCTIVE PARTICLE, CONDUCTIVE MATERIAL, AND CONNECTION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2017/199987
Kind Code:
A1
Abstract:
Provided is a conductive particle capable of conductive connection at relatively low temperatures and of enhancing conduction reliability even when conductive connection is performed at relatively low temperatures. This conductive particle includes a conductive particle body having a conductive part, and an insulating particle disposed on the surface of the conductive particle body. The conductive particle body has a plurality of projections on an outer surface of the conductive part, the glass transition temperature of the insulating particle is below 100°C, and the insulating particle is deformable such that when the insulating particle is compressed under at least one compression parameter satisfying compression parameters of a temperature of 100 to 160°C and a pressure of 60 to 80MPa, the proportion of the greatest particle diameter of the insulating particle after compression in the compression direction to the greatest particle diameter of the insulating particle after compression in a direction intersecting the compression direction is 0.7 or less.
Inventors:
YAMAGIWA HITOSHI (JP)
MAHARA SHIGEO (JP)
MAHARA SHIGEO (JP)
Application Number:
PCT/JP2017/018462
Publication Date:
November 23, 2017
Filing Date:
May 17, 2017
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
H01B5/00; H01B1/00; H01B1/22; H01B5/16; H01R11/01; H01R43/00
Foreign References:
| JP2005044773A | 2005-02-17 | |||
| JP2015187984A | 2015-10-29 | |||
| JP2014017213A | 2014-01-30 | |||
| JP2007537572A | 2007-12-20 | |||
| JP2012124035A | 2012-06-28 |
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
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