Title:
CONDUCTIVE PARTICLE, CONDUCTIVE MATERIAL, AND CONNECTION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2020/189776
Kind Code:
A1
Abstract:
Provided is a conductive particle which makes it possible to effectively suppress cracking of a conductive portion during mounting and effectively reduce connection resistance between electrodes. The conductive particle according to the present invention includes a base particle, a first conductive portion arranged on the surface of the base particle, and a second conductive portion arranged on the surface of the first conductive portion, the first conductive portion includes nickel and boron and does not contain phosphorus, an absolute value of the difference between an average amount of boron in 100% by weight in a region having a thickness of 1/5 from the inner surface of the first conductive portion toward the outer side and an average amount of boron in 100% by weight in a region having a thickness of 1/5 from the outer surface of the first conductive portion toward the inner side is 0-10% by weight, and a standard electrode potential of a main metal in the first conductive portion is smaller than a standard electrode potential of a main metal in the second conductive portion.
Inventors:
GOTOU YUUSUKE (JP)
SASADAIRA MASAO (JP)
SASADAIRA MASAO (JP)
Application Number:
PCT/JP2020/012462
Publication Date:
September 24, 2020
Filing Date:
March 19, 2020
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
H01B1/00; H01B1/22; H01B5/00; H01B5/16; H01R11/01
Foreign References:
| JP2014241280A | 2014-12-25 | |||
| JP2016006764A | 2016-01-14 | |||
| JP2017009702A | 2017-01-12 |
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
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