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Title:
CONDUCTIVE PASTE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2019/235540
Kind Code:
A1
Abstract:
The present invention is a conductive paste composition which is configured to contain, as essential ingredients, a binder (component (A)), a diluent (component (B)), a crosslinking agent and/or a curing catalyst (component (C)), a conductive powder (component (D)) and a compound having an ion pair (component (E)). This conductive paste composition has low electrical resistance, while exhibiting excellent adhesion to a base material.

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Inventors:
TAMAI HITOSHI (JP)
KANEMATSU MASANORI (JP)
ADACHI DAISUKE (JP)
Application Number:
PCT/JP2019/022397
Publication Date:
December 12, 2019
Filing Date:
June 05, 2019
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Assignee:
KANEKA CORP (JP)
International Classes:
H01B1/22; H01B5/14; H01B13/00; H01L31/0224
Foreign References:
JP2013532195A2013-08-15
JP2002109957A2002-04-12
JP2010265388A2010-11-25
JP2016195048A2016-11-17
Attorney, Agent or Firm:
NIIYAMA Yuichi et al. (JP)
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