Title:
CONDUCTIVE PASTE, ELECTRONIC COMPONENT, AND MULTILAYER CERAMIC CAPACITOR
Document Type and Number:
WIPO Patent Application WO/2023/190613
Kind Code:
A1
Abstract:
Provided is a conductive paste of which adhesion with a base material is further improved. The conductive paste comprises a conductive powder, a binder resin, an additive, and an organic solvent, the additive comprising a compound having a structure indicated by structural formula (1) or structural formula (2). (wherein R1, R2, and R3 each independently represent a saturated or unsaturated aliphatic hydrocarbon group comprising 2 to 12 carbon atoms, the aliphatic hydrocarbon group may be straight or branched, and one or more methylenes (-CH2-) included in the aliphatic hydrocarbon group may be substituted with oxygen (-O-)).
Inventors:
YOSHIDA NAOFUMI (JP)
AIKAWA TATSUO (JP)
TAKANO KIYOSHI (JP)
KAWAMURA TAKUYA (JP)
NARITA SHUSEI (JP)
FUKUDA KENJI (JP)
AIKAWA TATSUO (JP)
TAKANO KIYOSHI (JP)
KAWAMURA TAKUYA (JP)
NARITA SHUSEI (JP)
FUKUDA KENJI (JP)
Application Number:
PCT/JP2023/012692
Publication Date:
October 05, 2023
Filing Date:
March 28, 2023
Export Citation:
Assignee:
SUMITOMO METAL MINING CO (JP)
International Classes:
H01G4/30; C09D5/24; C09D7/61; C09D7/63; C09D129/14; H01B1/22; H05K1/09; H05K1/16
Domestic Patent References:
| WO2021106470A1 | 2021-06-03 | |||
| WO2020137290A1 | 2020-07-02 | |||
| WO2019107501A1 | 2019-06-06 |
Foreign References:
| JP2017183247A | 2017-10-05 | |||
| JP2006004905A | 2006-01-05 |
Attorney, Agent or Firm:
USAMI, Aya et al. (JP)
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