Title:
CONDUCTIVE PASTE AND CONDUCTIVE FILM
Document Type and Number:
WIPO Patent Application WO/2022/054775
Kind Code:
A1
Abstract:
Provided is a conductive paste that achieves both good adhesion and conductivity. This conductive paste includes a binder (A), a metal powder (B), boric acid (C), and an organic solvent (D). The binder (A) includes a (meth) acrylic resin (a) having a hydroxyl group.
Inventors:
NISHIKAWA TEPPEI
HAMADA NOBUHITO
TANAKA SHINYA
SAKAI SHIZUO
KOGA SHINYA
HAMADA NOBUHITO
TANAKA SHINYA
SAKAI SHIZUO
KOGA SHINYA
Application Number:
PCT/JP2021/032756
Publication Date:
March 17, 2022
Filing Date:
September 07, 2021
Export Citation:
Assignee:
GOO CHEMICAL CO LTD (JP)
International Classes:
C08F8/14; C08F20/28; C08F299/00; C08K3/08; C08K3/38; C08L33/14; H01B1/22; H01B5/14
Foreign References:
| JP2007086661A | 2007-04-05 | |||
| JP2010165997A | 2010-07-29 | |||
| JP2013225461A | 2013-10-31 |
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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