Title:
CONDUCTIVE PASTE, METHOD FOR FORMING WIRING, ELECTRONIC COMPONENT, AND SILICON SOLAR CELL
Document Type and Number:
WIPO Patent Application WO/2013/172362
Kind Code:
A1
Abstract:
This conductive paste is such that the printing properties and sintering properties are superior and is formed such that resistance of wiring after sintering is lowered.
This conductive paste is characterized by being formed from copper-based metal particles and by an aspect ratio (dmax/dmin), which is defined as the ratio of the maximum diameter (dmax) and minimum diameter (dmin) for the metal particles, being greater than or equal to 1.0 and less than 2.2.
Inventors:
KOIKE JUNICHI (JP)
HOAN TRI HAI (JP)
HOAN TRI HAI (JP)
Application Number:
PCT/JP2013/063472
Publication Date:
November 21, 2013
Filing Date:
May 08, 2013
Export Citation:
Assignee:
UNIV TOHOKU (JP)
International Classes:
H01B1/22; B22F1/05; B22F1/10; C22C9/00; H01B1/00; H01B13/00; H01L31/04; H05K1/09; H05K3/12
Domestic Patent References:
| WO2004103043A1 | 2004-11-25 |
Foreign References:
| JP2002343135A | 2002-11-29 | |||
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Other References:
See also references of EP 2851907A4
Attorney, Agent or Firm:
FUKUDA Kenzo et al. (JP)
Kenzo Fukuda (JP)
Kenzo Fukuda (JP)
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