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Title:
CONDUCTIVE PASTE, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/202434
Kind Code:
A1
Abstract:
This conductive paste includes: a silver powder; a compound represented by general formula (1), R1-(cyclohexyl)-(CH2)n-OH (in formula (1), n is an integer of 0-4, and R1 is a hydrogen atom, a hydroxyl group, a C1-C6 organic group, or a C1-C6 organic group substituted with a hydroxyl group); and a diluent.

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Inventors:
ABE YUI (JP)
WATABE NAOKI (JP)
TAKAMOTO MAKOTO (JP)
Application Number:
PCT/JP2022/011253
Publication Date:
September 29, 2022
Filing Date:
March 14, 2022
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
C08G59/40; H01B1/22; H01L21/52
Domestic Patent References:
WO2012102304A12012-08-02
Foreign References:
JP2013249390A2013-12-12
JP2016072595A2016-05-09
JP2018190540A2018-11-29
JP2011071057A2011-04-07
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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