Title:
CONDUCTIVE PASTE
Document Type and Number:
WIPO Patent Application WO/2019/116787
Kind Code:
A1
Abstract:
Provided is a thermosetting conductive paste which is able to be processed at low temperatures (for example, at 250°C or less), and which enables the achievement of a conductive film that has low resistivity. A conductive paste which contains (A) a conductive component, (B) a thermosetting resin, (C) a compound having a specific structure, and (D) a solvent.
Inventors:
MURAMATSU KAZUO (JP)
TANABE HIDEO (JP)
TANABE HIDEO (JP)
Application Number:
PCT/JP2018/041303
Publication Date:
June 20, 2019
Filing Date:
November 07, 2018
Export Citation:
Assignee:
NAMICS CORP (JP)
International Classes:
H01B1/22; C08K3/08; C08K5/17; C08K5/42; C08L33/04; C08L63/00; C08L101/00; H01L31/0224; H01L31/0747
Domestic Patent References:
| WO2014109186A1 | 2014-07-17 | |||
| WO2015098525A1 | 2015-07-02 |
Foreign References:
| JP2014089818A | 2014-05-15 | |||
| JP2017066218A | 2017-04-06 | |||
| JP2015507680A | 2015-03-12 | |||
| JP2014089818A | 2014-05-15 | |||
| JP2015507680A | 2015-03-12 | |||
| JP2016069624A | 2016-05-09 |
Other References:
See also references of EP 3726538A4
Attorney, Agent or Firm:
TSUKUNI & ASSOCIATES et al. (JP)
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