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Patent Searching and Data


Title:
CONDUCTIVE POLYMER COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2020/129854
Kind Code:
A1
Abstract:
Provided is a conductive polymer composition having excellent coating film moist heat resistance. The present invention provides a conductive polymer composition containing a solvent and a π conjugated conductive polymer, wherein the conductive polymer composition contains a vinyl sulfone group-containing compound containing a vinyl sulfone group as a dopant or additive for the conductive polymer, and in the case where the vinyl sulfone group-containing compound is contained as the additive, the vinyl sulfone group-containing compound contains a plurality of the vinyl sulfone groups.

Inventors:
MIYAMOTO TAKESHI (JP)
Application Number:
PCT/JP2019/048994
Publication Date:
June 25, 2020
Filing Date:
December 13, 2019
Export Citation:
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Assignee:
SOKEN KAGAKU KK (JP)
International Classes:
C08G61/12; C08K5/37; C08K5/42; C08L65/00; H01B1/12
Domestic Patent References:
WO2018221438A12018-12-06
WO2016111277A12016-07-14
Foreign References:
CN105733260A2016-07-06
JP2003330145A2003-11-19
CN105566861A2016-05-11
CN105111416A2015-12-02
JP2004109586A2004-04-08
JP2015221873A2015-12-10
JP2019172770A2019-10-10
JP2018022727A2018-02-08
Other References:
See also references of EP 3901192A4
Attorney, Agent or Firm:
SK INTELLECTUAL PROPERTY LAW FIRM et al. (JP)
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