Title:
CONDUCTIVE RESIN COMPOSITION, ELECTROMAGNETIC WAVE SHIELD LAYER, AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2024/009833
Kind Code:
A1
Abstract:
The present invention relates to a conductive resin composition containing silver-containing particles as a component (A) and a thermosetting resin and/or a thermoplastic resin as a component (B). The indentation elastic modulus EIT found from a load-displacement curve obtained by means of a nanoindentation test of procedures described in the specification is 10-20 GPa.
Inventors:
YAMAGUCHI TAKASHI (JP)
YONEDA TAKASHI (JP)
YONEDA TAKASHI (JP)
Application Number:
PCT/JP2023/023680
Publication Date:
January 11, 2024
Filing Date:
June 26, 2023
Export Citation:
Assignee:
NAMICS CORP (JP)
International Classes:
C08L101/00; C08K3/08; C08L63/00; C09D5/24; C09D7/61; C09D163/00; H05K9/00
Foreign References:
| JP2021107476A | 2021-07-29 | |||
| JP2019056104A | 2019-04-11 |
Attorney, Agent or Firm:
EIKOH, P.C. (JP)
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