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Title:
CONDUCTIVE RESIN COMPOSITION, MASTER BATCH, MOLDED BODY, AND PRODUCTION METHODS THEREFOR
Document Type and Number:
WIPO Patent Application WO/2024/053535
Kind Code:
A1
Abstract:
The present invention provides a molded body that has high electromagnetic shielding properties or conductivity without negatively affecting mechanical properties, a conductive resin composition for providing the molded body, a master batch, and production methods therefor. More specifically, the present invention provides: a conductive resin composition in which a thermoplastic resin and a carbon nanostructure are melt-kneaded as essential starting materials, the carbon nanostructure is obtained by binding carbon nanotubes and glass fibers by means of a binder resin, and the content of the carbon nanostructure is 0.1-30 parts by mass with respect to 100 parts by mass of the thermoplastic resin; a master batch whereby it is possible to provide the conductive resin composition; and production methods therefor.

Inventors:
SUZUKI TORU (JP)
MIZUTANI SHOMA (JP)
Application Number:
PCT/JP2023/031681
Publication Date:
March 14, 2024
Filing Date:
August 31, 2023
Export Citation:
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Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C08L101/00; C08J3/22; C08K3/04; C08K7/14; C08L23/00; C08L67/00; C08L77/00
Domestic Patent References:
WO2022004235A12022-01-06
WO2022004236A12022-01-06
WO2022181696A12022-09-01
Foreign References:
JP7112804B12022-08-04
JP2013513020A2013-04-18
JP2012057082A2012-03-22
JP2017512847A2017-05-25
Attorney, Agent or Firm:
ONO Takayuki (JP)
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