Title:
CONDUCTIVE RESIN COMPOSITION AND PRODUCTION METHOD FOR SHIELDED PACKAGE USING SAME
Document Type and Number:
WIPO Patent Application WO/2018/230109
Kind Code:
A1
Abstract:
Provided are: a conductive resin composition which has good shielding properties, good adhesion to a package, and which can, by spray coating, form a shield layer that is less likely to discolor even under severe heating conditions; and a production method for a shielded package using the conductive resin composition. The conductive resin composition contains at least (A) a compound which is represented by general formula (I), has a molecular weight of 500-2000, and has two or more maleimide groups in one molecule, (B) a thermosetting compound, (C) a compound having an imidazole group, and (D) a conductive filler.
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Inventors:
UMEDA HIROAKI (JP)
MATSUDA KAZUHIRO (JP)
NAKAZONO HAJIME (JP)
MATSUDA KAZUHIRO (JP)
NAKAZONO HAJIME (JP)
Application Number:
PCT/JP2018/014287
Publication Date:
December 20, 2018
Filing Date:
April 03, 2018
Export Citation:
Assignee:
TATSUTA ELECTRIC WIRE & CABLE CO LTD (JP)
International Classes:
C08L63/00; C08K3/08; C08K5/34; C08K5/3445; C08L33/10; C08L101/12; H01L23/00; H01L23/28
Domestic Patent References:
| WO2016051700A1 | 2016-04-07 |
Foreign References:
| JP2009179725A | 2009-08-13 | |||
| JP2017008160A | 2017-01-12 | |||
| JP2008063449A | 2008-03-21 | |||
| JP2003258137A | 2003-09-12 |
Attorney, Agent or Firm:
TSUTADA, Masato et al. (JP)
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