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Patent Searching and Data


Title:
CONDUCTIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2014/046102
Kind Code:
A1
Abstract:
This conductive sheet has a structure wherein a conductive adhesive layer is laminated on one surface of a base substrate and a light-blocking insulating layer is laminated on the other surface of the base substrate. A substrate which has a structure wherein metal layers of the same kind are formed on both surfaces of a resin film is used as the base substrate. In this connection, the surface of the light-blocking insulating layer of this conductive sheet has a surface resistance of 1.0 × 108 Ω/□ or more, a gloss of 80% or less, and an optical density of 1.0 or more.

Inventors:
KURODA DAISUKE (JP)
Application Number:
PCT/JP2013/075078
Publication Date:
March 27, 2014
Filing Date:
September 18, 2013
Export Citation:
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Assignee:
DEXERIALS CORP (JP)
International Classes:
B32B15/08; B32B7/02; C09J7/29; C09J9/02; C09J11/04; C09J201/00; G02B5/22; H01B5/14
Foreign References:
JP2010147235A2010-07-01
JP2009188007A2009-08-20
JP2007272161A2007-10-18
JP2007121608A2007-05-17
JP2005002532A2005-01-06
JPS62227985A1987-10-06
Other References:
See also references of EP 2899020A4
Attorney, Agent or Firm:
TAJIME & TAJIME (JP)
Patent business corporation Tajime international patent firm (JP)
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