Title:
CONDUCTIVE SILVER PASTE FOR 5G MOBILE PHONE ANTENNA AND PREPARATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2022/205492
Kind Code:
A1
Abstract:
The present invention relates to a conductive silver paste for a 5G mobile phone antenna and a preparation method therefor. The conductive silver paste comprises the following components in parts by weight: 45-50 parts of flake silver powder, 5-10 parts of nanorod silver powder, 2-5 parts of superfine diamond powder, 10-15 parts of phenoxy resin, 5-10 parts of alicyclic epoxy resin, 5-10 parts of propylene glycol methyl ether acetate, 5-10 parts of isophorone, 0.5-1 part of a cationic curing agent, 0.2-0.5 part of fumed silica and 0.1-0.5 part of superfine flake graphite. The preparation method comprises: pre-mixing of a resin carrier, heat treatment of powder, batching, high-speed dispersion, three-roller grinding, filtering, detection of finished product, homogeneous stirring and canning. Compared with the prior art, the conductive silver paste of the present invention has the advantages of low curing temperature, high printing resolution, good electrical conductivity, high hardness, good bonding strength and wear resistance, and environmental protection.
Inventors:
JIANG HAIHAN (CN)
ZHU QINGMING (CN)
WANG DELONG (CN)
LIU JIALU (CN)
ZHU QINGMING (CN)
WANG DELONG (CN)
LIU JIALU (CN)
Application Number:
PCT/CN2021/086302
Publication Date:
October 06, 2022
Filing Date:
April 10, 2021
Export Citation:
Assignee:
SHANGHAI BAOYIN ELECTRONIC MAT CO LTD (CN)
International Classes:
H01B13/00; H01B1/22
Foreign References:
| CN111489847A | 2020-08-04 | |||
| CN111243781A | 2020-06-05 | |||
| CN110310760A | 2019-10-08 | |||
| CN105788700A | 2016-07-20 | |||
| JP2001327884A | 2001-11-27 |
Attorney, Agent or Firm:
SHANGHAI KESHENG INTELLECTUAL PROPERTY AGENCY LTD. (CN)
Download PDF:
Previous Patent: METAL-ORGANIC FRAMEWORK COMPOSITE MATERIAL AND PREPARATION METHOD THEREFOR
Next Patent: TEST PLATFORM
Next Patent: TEST PLATFORM