Title:
CONDUCTIVE SUBSTRATE, AND METHOD FOR MANUFACTURING CONDUCTIVE SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2017/022596
Kind Code:
A1
Abstract:
Provided is a conductive substrate having: a transparent base; a metal layer formed on at least one surface of the transparent base; a protective layer formed on the metal layer, the protective layer containing an organic compound that includes sulfur atoms and/or nitrogen atoms; and a blackening layer formed on the protective layer.
Inventors:
SHIGA DAIKI (JP)
HATA HIROKI (JP)
NISHIYAMA YOSHIHIDE (JP)
SUDA TAKAHIRO (JP)
YEH YU-CHOU (TW)
YEH TSUNG-HER (TW)
HU CHIH-MING (TW)
ARIMA HIRONOBU (JP)
HATA HIROKI (JP)
NISHIYAMA YOSHIHIDE (JP)
SUDA TAKAHIRO (JP)
YEH YU-CHOU (TW)
YEH TSUNG-HER (TW)
HU CHIH-MING (TW)
ARIMA HIRONOBU (JP)
Application Number:
PCT/JP2016/072055
Publication Date:
February 09, 2017
Filing Date:
July 27, 2016
Export Citation:
Assignee:
SUMITOMO METAL MINING CO (JP)
J TOUCH CORP (TW)
J TOUCH JAPAN CORP (JP)
J TOUCH CORP (TW)
J TOUCH JAPAN CORP (JP)
International Classes:
G06F3/041; B32B15/04; C23C14/14; G06F3/044; H01B5/14; H01B13/00
Foreign References:
| JP2013228986A | 2013-11-07 | |||
| JP2014219963A | 2014-11-20 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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